Process tube for manufacturing semiconductor wafers



FIG. 1 is a perspective view of the design for a process tube for manufacturing semiconductor wafers in accordance with the invention;

FIG. 2 is a front view thereof;

FIG. 3 is a rear view thereof;

FIG. 4 is a right side view thereof;

FIG. 5 is a left side view thereof;

FIG. 6 is a top view thereof;

FIG. 7 is a bottom view thereof;

FIG. 8 is a sectional view through line 8—8 of FIG. 6;

FIG. 9 is an enlarged detailed top plan view of the portion of the process tube in the rectangle shown in FIG. 8; and,

FIG. 10 is an enlarged detailed sectional view taken along line 8—8 in FIG. 6 of the portion of the process tube in the rectangle shown in FIG. 8.

Environmental structure, which forms no part of the claimed design, is illustrated in broken lines.

The design is a type of process tube for decompression (vacuum) equipment. 

The ornamental design for a process tube for manufacturing semiconductor wafers, as shown and described. 